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During the development of new materials for electrical engineering and electronic applications, research activities in the PolyComp network also focus on the important topic of environmental impact. In cooperation with the Siemens AG Öster-reichTransformers Weiz, a casein-adhesive for the bonding of transformer boards was developed, which is based on milk proteins. The dielectric properties of this adhesive from renewable resources exceed those of their epoxy-based congeners.

As part of the strategic research in the PolyComp network and in collaboration with the Vienna University of Technology, the frontal polymerization has been validated as a new process technology for the curing of resins and composites. This method provides the key advantage that the cross-linking of resins is initiated by the irradiation with light, and concomitantly can only be activated by an external stimulus such as irradiation. If the curing of resins is a time-consuming process due to the geometry or the large surface to be bonded for instance, the frontal polymerization and its inherent switchability pave the way for the elimination of inhomogeneities in the cured resin.

The competence network PolyComp (Functional Polymer Composites) investigates innovative material concepts and process technologies with a high potential of industrial marketability in order to develop new materials for electrical engineering and electronics. This network is unique in Austria, and particularly considers the important issues of environmental relevance and operation reliability of devices. Aiming at the implementation of these ambitious targets, an international research team collaborates in this interdisciplinary research network.