The K project PolyComp aims at the development of novel “Functional Polymer Composites”, hence the development of novel materials and processing routines for the next generation of transformers, generators, and printed circuit boards. Light-house examples comprise the development and testing/application of insulation composites (based on nano-scaled materials) for high-voltage applications, insulation composites with high thermal conductivity for high-voltage generators, novel adhesives for transformer boards, and novel interfacial/surficial technologies for printed circuit boards.
Along with the high energy density in new media for power generation and storage, the materials used for their assembly must meet a complex requirement profile. Meeting the interdisciplinary character of the research, material scientists, chemists, plastics engineers and electrical engineers collaborate in the PolyComp project with the primary aim to translate research findings into marketable products and processes in concerted manner.
Research within the PolyComp project focuses on the areas:
- Components for high voltage insulation with high thermal conductivity
- Stress gradings based on semiconducting composites of silicon carbide micro¬spheres and epoxy resins
- Advanced resins for electrical engineering applications
- Functional adhesives with high temperature and chemical resistance for ultrahigh voltage applications
- Interfacial adhesion in printed circuit boards
- Smart functionalization of inorganic particles and alternative curing techniques for composites
