Project title: Ambi PV - Adapted Modules for Bifacial Photovoltaics

Project lead: Polymer Competence Center Leoben GmbH

Funding: Solar Era Net, FFG

Project period: 10/2019 - 09/2022

Scientific Partners:

Company Partners:

The project Ambi PV focuses on new interconnection approaches for bifacial solar cells. The higher current in bifacial modules causes increased ohmic power losses which can be addressed by advanced interconnection techniques such as the SmartWire-technology (SWCT), shingling, 1/2 cells or combined approaches. Three interconnection technologies are investigated, including related optimizations of the cell/module materials and lay-outs.

A new shingling concept without gluing, based on the Smart Wire Interconnection Technology (SWCT). The project aims at an adapted SWCT production equipment in form of a functional device.

Shingling, based on electrically conductive adhesives (ECA), is investigated in parallel. In contrast to other studies, adapted materials and module / cell layouts are in the focus.

Another new concept is the use of SWCT for the interconnection of IBC (Interdigitated Back Con-tact) cells. The goal is to demonstrate the feasibility and to reveal the properties.

Each of these approaches has specific challenges which are not only related to the interconnection process but also to the respective module and cell design. So, the mechanical stress due to e.g. bending of the laminate will affect the interconnection of shingled cells in a different way than wire connected ones. The tensile or compressive stress on an ECA glued interconnection will be different if the cell matrix is embedded along the neutral fiber in a glass/glass- or in a glass/backsheet- module. Particularly the thermomechanical properties and the thickness of the embedding material and rear layer have to be adapted to the specific conditions as well as the cell layout.

The innovative techniques are compared to standard approaches to reveal their advantages and drawbacks. This allows a benchmarking with regard to module efficiencies, their reliability and related cost. The results will provide a sound basis for further decisions and deliver material for dissemination and publication.


DI Dr. Gernot Oreski
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