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In the virtual design development and performance assessment of polymer and polymer composite components the materials complexity necessitate sophisticated approaches and methods. Besides some general methods some solutions need to be specifically developed for defined applications. In most cases the resulting methods are routines based on algorithms developed within the group used in interaction with a finite element solver. Challenges which are worked on are for example

Multi-scale modeling

Gschwandl, M., Fuchs, P., Fellner, K., Antretter, T., Krivec, T., Qi, T.: Finite Element Analysis of Arbitrarily Complex Electronic Devices. IEEE 18th Electronics Packaging Technology Conference (EPTC) , 497–500

Failure and lifetime prediction

Fellner, K., Antretter, T., Fuchs, P.F., Tao, Q.: Numerical simulation of the electrical performance of printed circuit boards under cyclic thermal loads. Microelectronics Reliability 62, 148–155 (2016). doi: 10.1016/j.microrel.2016.03.034

Process induced component performance influences

Mario Gschwandl, Peter Filipp Fuchs, Ivaylo Mitev, Mahesh Yalagach, Thomas Antretter, Tao Qi, Angelika Schingale: Modeling of Manufacturing Induced Residual Stresses of Viscoelastic Epoxy Mold Compound Encapsulations. IEEE 19th Electronics Packaging Technology Conference (EPTC) . Accessed 19 January 2018

Fracture and Delamination

Fuchs, P.F., Major, Z.: Experimental Determination of Cohesive Zone Models for Epoxy Compo-sites. Exp Mech 51(5), 779–786 (2011). doi: 10.1007/s11340-010-9370-2

Special Test Set Ups

Fuchs, P.F., Pinter, G., Krivec, T.: Design independent lifetime assessment method for PCBs under low cycle fatigue loading conditions. EuroSimE 2014. doi: 10.1109/EuroSimE.2014.6813787

Metamaterials

Mansouri, M.R., Montazerian, H., Schmauder, S., Kadkhodapour, J.: 3D-printed multimaterial composites tailored for compliancy and strain recovery. Composite Structures 184, 11–17 (2018). doi: 10.1016/j.compstruct.2017.09.049

Micromechanis

Fuchs, P., Pinter, G., Tonjec, M.: Determination of the orthotropic material properties of individual layers of printed circuit boards. Microelectronics Reliability 52(11), 2723–2730 (2012). doi: 10.1016/j.microrel.2012.04.019

 

Division Manager - Contact DI Dr. Peter Fuchs

Dr. Peter Fuchs

DI Dr. Peter Fuchs
peter.fuchs@pccl.at